The board of directors of ASE (Advanced Semiconductor Engineering Inc.) has approved the issuance of US$400 million overseas convertible bonds (ECB), a move that is believed to strengthen its advanced process technology, reported Economic Daily News on October 16. The bond sale plan is scheduled to be completed in November, said the company. With orders from Apple for packaging and testing services of Touch ID and iWatch chips, ASE's operation has been taking off. It has increased its capital expenditure this year from US$600 million to around US$1 billion. ASE's deployment in advanced process technology includes flip chip, SiP, MEMS, 2.5D/3D IC, and Cu-pillar bumping.